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Face attributes are interesting due to their detailed description of human faces. Unlike prior researches working on attribute prediction, we address an inverse and more challenging problem called face attribute manipulation which aims at modifying a face image according to a given attribute value. Instead of manipulating the whole image, we propose to learn the corresponding residual image defined...
Fan-out wafer-level-packaging (FO-WLP) technology is developed with the advantages of smaller package size, higher Input/Output (I/O) counts, lower cost, and better performance. In this study, the FO-WLP technology is applied to TSV-less inter-connection technology of 2.5D IC packaging and a novel RDL-first wafer level packaging is demonstrated. Firstly, a pre-coated laser release layer at the interface...
In this paper, we investigate reliability testing for a glass interposer. The test vehicle is an assembled glass interposer with a chip, a BT substrate. The structure of a glass interposer with two redistribution layers (RDLs) on the front-side and one RDL on the back-side has been evaluated and developed. Key technologies, including via fabrication, front-side RDL formation, microbumping, temporary...
In this paper, we investigated the reliability test for Glass interposer. The test vehicle is assembled glass interposer with chip, BT substrate, and PCB. The structure of a glass interposer with two RDL on the front-side and one RDL on the backside had been evaluated and developed. Key technologies, including via fabrication, topside RDL formation, micro-bumping, temporary bonding, silicon and glass...
This paper describes a handling process for a thin glass panel, 200 mm × 200 mm × 130 (im, through double-side redistribution layer (RDL) formation to enable cost-effective fabrication of through-glass-via (TGV) interposers. The integration scheme includes lamination of a low-temperature bonding material utilizing a lamination process temperature of less than 100°C to bond a thin (130-μm) glass panel...
In this paper, we investigated the assembly characterization for reliability test. The structure of a glass interposer with two RDL on the front-side and one RDL on the backside had been evaluated and developed. Key technologies, including via fabrication, topside RDL formation, micro-bumping, temporary bonding, glass thinning and backside RDL formation, were developed and integrated to perform well...
Glass interposer is proposed as a superior alternative to organic and silicon-based interposers for 3DIC packaging in the near future. Because glass is an excellent dielectric material and could be fabricated with large size, it provides several attractive advantages such as excellent electrical isolation, better RF performance, better feasibility with CTE and most importantly low cost solution. In...
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