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This work presents electromigration reliability and patterns of Sn-3Ag-0.5Cu and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder joints with Ti/Ni(V)/Cu under bump metallurgy (UBM), bonded on Au/Ni/Cu substrate pads. The solder joints were subjected to an average current density of 5 kA/cm2 under an ambient temperature of 150degC. Under the situation when electron charges flow from the UBM towards...
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