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The effects of colloidal silica on the CMP of Molybdenum (Mo) are investigated in different slurries with H2O2 as oxidizer. It is found that both RR (removal rate) and SER (static etching rate) decrease after adding colloidal silica into the alkaline slurry. The adsorption between the colloidal silica particles and Mo film is observed. Raman spectra show that silicomolybdic acid forms from reaction...
In this work, a novel single layer CoMo alloy film is investigated as an excellent adhesion/diffusion barrier to copper metallization. The ultrathin (<3nm) CoMo film can withstand 400°C/30min annealing on the ULK(k =2.25) and the electrical barrier properties on the p-cap SiO2 structure for the Cu/CoMo can be even better than the Cu/Ta/TaN structure. The CMP of the CoMo film are studied and the...
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