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Electromagnetic (EM) and circuit modeling are the prevailing practices for the anticipation and extraction of data transfer performances of 3D interconnects in a system-in-package (SiP). In comparison, this paper proposes a more abstract and cost-efficient evaluation method and an enhancement method thereof from the perspective of network information theory and communication channel modeling. Firstly,...
In this paper, high frequency measurement of TSV structures under different DC bias conditions are carried out. The impact of the MOS capacitance effect of TSV on its transmission performance is analyzed. Capacitance and conductance parameters of TSV are extracted and compared with numerical calculations.
Three-dimensional integration technology is deemed as the most promising alternative in post Moore's Law era. The electrical performance of through silicon vias (TSVs), which are the key enabler for 3D integration, is crucial to modeling and design of 3D systems, especially for high-speed systems. This paper gives a partial review on recent progress in the field with the focus on the high-frequency...
Most current three-dimensional reconstruction methods often require at least two or more input images to reconstruct the shape of the object. Traditionally, it is hard to reconstruct the 3D shape only from one single input image. In this paper, we propose an effective method to reconstruct the 3D texture surface from a single input image for the texture with similar appearances and reflectance properties...
Volumetric methods provide efficient, flexible and simple ways of integrating multiple depth images into a full 3D model. They provide dense and photorealistic 3D reconstructions, and parallelised implementations on GPUs achieve real-time performance on modern graphics hardware. To run such methods on mobile devices, providing users with freedom of movement and instantaneous reconstruction feedback,...
Aiming at the problem of the formation of thrombosis and coronary restenosis, the formation mechanism of thrombosis was studied in this paper. The simulation model of platelet particles was established based on the theory of discrete element. And the simulation model describing the flow of blood was built based on the principle of hemodynamic. Then by means of the DEM-CFD coupling technology, a simulation...
Three-dimensional (3D) integration has been considered as the most promising method to overcome the interconnection bottleneck with through-silicon vias(TSVs) served as vertical signal channels. Three-dimensional integrated circuits (3D IC) meet the demands of high throughput, high scalability and low power consumption for future generation integrated circuits. Crosstalk is the dominant problem in...
With the technology nodes keep advancing, the application of TSV(Through Silicon Via) technology in 3D integration is faced with more challenges. The shift from via-last to via-middle fabrication scheme, the ever-increasing density of TSV, the reduction in supply voltage and the increase in frequency of on-chip local clock, all pose threat to signal/power integrity of the TSV system. In this paper,...
With the technology nodes keep advancing, the application of TSV(Through Silicon Via) technology in 3D integration is faced with more challenges. The shift from via-last to via-middle fabrication scheme, the ever-increasing density of TSV, the reduction in supply voltage and the increase in frequency of on-chip local clock, all pose threat to signal/power integrity of the TSV system. In this paper,...
Three-dimensional (3D) integration has been considered as the most promising method to overcome the interconnection bottleneck with through-silicon vias(TSVs) served as vertical signal channels. Three-dimensional integrated circuits (3D IC) meet the demands of high throughput, high scalability and low power consumption for future generation integrated circuits. Crosstalk is the dominant problem in...
This paper focuses on the electrical simulation and analysis of silicon interposer. Basic interconnect elements such as TSV and RDL are simulated and verified with measurement results, electrical parameters are extracted and analyzed. Segmentation is used in long signal path modeling to improve simulation efficiency with a fine accuracy. Silicon interposer is segmented into many interconnect pieces...
Three potential contributing factors to the TSV leakage and breakdown are discussed and analyzed in this study. In addition, an in-line testing methodology is put forward so that leakage and breakdown data could be easily obtained. Finite element method simulation was used to illustrate the testing principle, and experimental test were carried out for validation. It was found that the most contributing...
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