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This article describes the Earth System Grid Federation (ESGF) mission and an international integration strategy for data, database and computational architecture, and stable infrastructure highlighted by the authors (the ESGF Executive Committee). These highlights are key developments needed over the next five to seven years in response to large-scale national and international climate community...
One Step Chip Attach (OSCA) materials are chemically engineered organic fluids that function both as underfills and fluxes for flip chip assembly. These emerging materials chemically remove solder oxides and surface finishes to facilitate soldering during reflow while simultaneously curing to form a rigid reinforcing polymeric underfill that improve the reliability of the finished product. The key...
Unconventional multi- and many-core processors (e.g., IBM® Cell B.E. ™ and NVIDIA® GPU) have emerged as effective accelerators in trial climate and weather simulations. Yet these climate and weather models typically run on parallel computers with conventional processors (e.g., Intel®, AMD®, and IBM) using Message Passing Interface (MPI). To address challenges involved in efficiently and easily connecting...
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