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In this study, we reported the development of a novel highly electrically conductive adhesive (ECA) that can be used in ink-jet printing and have the function of adhesive by a single step of low temperature sintering/curing. With the introduction of silver nanoparticles into the formulation, the electrical resistivity of the resulting ECAs is about 10-5 ohm-cm after sintering at 180degC or using a...
Highly conductive anisotropic conductive films (ACFs) with in-situ reduced silver nanoparticles as fillers were developed. During the preparation of ACF formulation, the silver nanoparticles were reduced by the hydroxyl groups from the phenoxy resin through the polyol process. Due to the capping effects of the epoxy resin, the in-situ reduced silver nanoparticles were well dispersed in the polymer...
In-situ synthesis of Ag nanoparticles was successfully carried out in various epoxy matrix by photochemical method. The effects of reducing agent type, concentration of metal precursor, epoxy matrix type and additives on the morphology of nanoparticles were explored. Transmission electronic microscopy (TEM), scanning electron microscopy (SEM) and X-ray diffraction (XRD) were used to characterize the...
Silver migration has long been one of the most critical issues in semiconductor electronic industry, while no effective approaches have been developed to control silver migration and maintain its excellent electrical and thermal properties. In this paper, we report a novel approach of using molecular self-assembled monolayers (SAMs) to dramatically reduce silver migration in the nano-Ag conductive...
Conductive filler-polymer composite materials have been extensively investigated as conductor-insulator percolative system to achieve high dielectric constant (K). Additionally, the effective dielectric constant of conductive filler/polymer composite can be dramatically enhanced by increasing the dielectric constant of polymer matrix according to scaling theory. However, the high dielectric loss of...
Electrical properties of the isotropic conductive adhesives filled with micron sized silver flakes and nanosized silver particles were investigated. By using appropriate surfactants, the resistivity of the silver flakes and silver nanoparticles incorporated conductive adhesives was dramatically reduced to as low as 5 times 10-6 Omega.cm. Morphology studies showed that the decreased resistivity resulted...
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