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Anisotropic conductive adhesives (ACAs) have been considered as one of promising interconnect materials for next generation high performance devices. However, high joint resistance and low current carrying capability of ACA joints have been a bottleneck to deploy ACAs in high power devices. In this study, we introduced conjugated dithiols into ACA formulations to construct the molecular wire junction...
In this paper, a novel nano-scale conductive film which combines the advantages of both traditional anisotropic conductive adhesives/films (ACAs/ACFs) and nonconductive adhesives/films (NCAs/NCFs) is introduced and developed for next generation high performance ultra-fine pitch packaging applications. This novel interconnect film possesses the properties of electrical conduction along the z-direction...
Abstract form only given. Lead, a major component in solder, has long been recognized as a health threat to human beings. One of the proposed lead-free candidates is electrically conductive adhesives (EGAs), which are composed of polymer matrix and conductive fillers. Usually epoxy and silver flakes are used as the polymer matrix and conductive fillers, respectively. Recently, Ag nanoparticles were...
Electrically conductive adhesives (ECAs) are a promising alternative for lead-containing solders in electronic packaging. However, the conductivity of ECA is lower than that of solders due to the physical contact between conductive fillers and insulative organic lubricants on Ag flakes. In this study, a group of reducing agents were introduced into a typical ECA formulation. During the curing process,...
Although conductive adhesives have been studied for many years as a lead-free alternative in electronic industry, applications of electrically conductive adhesives (ECAs) for electronic interconnect are limited to low voltage display driver devices. This is due to the serious concerns associated with the long-term reliability and high voltage application issues caused by the silver migration. In this...
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