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This paper describes the use of Lock-In Thermography (LIT) technique to determine the defect Z-depth in flip chip. An empirical phase shift versus applied lock-in frequency plot for Flip-chip is first created by using samples with known defect Z-depth. The actual experimental phase shift data from reject samples with unknown defect locations are then measured and compared against the empirical phase...
Novel 3D architecture of electronics packages raises immense challenges for electrical fault isolation and physical failure analysis (PFA). This paper describes a streamlined workflow involving 3D X-ray Microscopy (XRM) to effectively bridge fault isolation and physical failure analysis (PFA). The case studies on chip-to-chip micro-bump interconnecting failure will be discussed. X-ray microscopy improved...
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