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The impact of the lifetime enhancement process using high temperature thermal oxidation method on 4H-SiC P-GTOs was investigated. 15 kV 4H-SiC P-GTOs with 140 μm thick drift layers, with and without 1450°C lifetime enhancement oxidation (LEO) process, were compared. The LEO process increased the average carrier lifetime in p-type epi layer from 0.9 μs to 6.25 μs, and it was observed that the effectiveness...
Due to their fast switching speed, knee-free forward characteristics, and a robust, low reverse recovery body diode, SiC MOSFETs are ideal candidates to replace silicon IGBTs in many high-power medium-voltage applications. 1700 V SiC MOSFETs have already been released to production at Wolfspeed based on its 2nd Gen technology. In this paper, we present our latest results in high voltage 4H-SiC MOSFET...
We present two new ternary alloy silicides with tunable work function ranging between 4.27eV to 4.7eV and 4.8eV to 5.0eV respectively for dual metal gate CMOS applications. NixTa1-xSi gates were investigated for NMOS and NixPt1-xSi gates were investigated for PMOS applications on SiO2, HfO 2 and HfSiOx dielectrics. A large degree of tuning was observed on SiO2 however the tuning range decreased as...
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