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Thermal fatigue and room temperature isothermal mechanical performance of various Pb-free and SnPb solder joints were examined. Various solder alloys doped with Ni (SN100C) and Mn (SAC105-Mn and SACM) were evaluated and compared to SAC105, SAC 205 SAC 305 and SAC 405 and eutectic SnPb alloys. Solder spheres ranging from 10 to 20 mils were reflowed on various printed circuit board (PCB) surface finishes...
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