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We present a new concept of a high-current SiC power module with the fast switching capability based on a stacked-ceramic-substrate structure. This approach enables to parallel many small area SiC devices in a housing of a Si half-bridge module. The internal design of the module — concept demonstrator was optimized using electromagnetic simulations in order to minimize stray inductance and balanced...
Chokes are crucial in power electronics applications to block the propagation of high-frequency disturbances produced in switching events. At high frequencies, the real behavior of a choke can differ significantly from its nominal behavior due to the frequency-dependency of core materials and due to parasitic couplings introduced by the windings. This paper presents an accurate, versatile, and computationally...
In this paper a comprehensive review on SiC power module challenges and technology approaches is given. These challenges originate from SiC-specific reduced chip area, from high power and high loss density operation, from high temperature capability, from fast switching transients and from high electric field operation. New approaches based on advanced integrated cooling, low-profile integrated topside...
Physical equivalent electrical circuits facilitate root-cause analysis of resonance phenomena in electromagnetic components. We extend an existing formalism for the generation of physical equivalent circuits by linking the resonant behaviour of the equivalent circuit with 3D electromagnetic eigenmodes of the component. We define a figure of merit, which we call quality, describing the frequency range...
Physical equivalent circuits are very useful for characterization of electrical components, because they allow fast and straightforward analysis of the electromagnetic properties. However, no general method for the construction of physical equivalent electrical circuits for complex 3D components exists. Based on earlier work, we present a method for the construction of physical equivalent circuits...
Physical equivalent circuits are powerful tools for EMC analysis of electronic devices, however their generation is in general cumbersome. In this paper, a procedure to generate physical equivalent circuits using 3D simulations is described. The method is based on a numerical computation of Z parameters using 3D simulations. Equivalent circuit tpoplogy and parameters are extracted from the simulated...
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