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The design flexibility of FOWLP plays a crucial role in meeting the rising demand for higher performance advanced semiconductor packages at lower cost. From a manufacturing standpoint, the requirements are not only for increased wafer throughput and tighter defects density specification, but also for low resistance interconnects. Keeping Rc low can be particularly challenging in UBM/RDL processes...
Organic passivated silicon wafers, composite substrates such as silicon on glass or Fan-out Wafer-Level Package (FOWLP) technology all pose new challenges for UBM and RDL processes [1]-[5]. Materials used in these substrates must be adequately degassed for subsequent plasma processing under vacuum but their heat-sensitive nature necessitates careful thermal management. Selecting the proper technology...
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