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A finite element model for evaluating the performance of the MEMS air flow sensor with sapphire as substrate was established. The temperature distribution of the MEMS sensor chip with respect to different air flow was calculated by COMSOL Multiphysics. The trenches etched in the substrate were used to reduce the heat transfer from the heater to the temperature measuring thermistors within the substrate...
In this paper, simulation model for the response time of micro flow sensor using COMSOL Multiphysics is presented. The detailed structure of the micro flow sensor chip is considered in the simulation model. What's more, the temperature dependencies of physical properties of air are defined to improve the model precision. The model takes into consideration the transient conduction and convection between...
The thermal effect on performance of micromachined hemispherical vibratory gyroscope subjected to environment temperature change was investigated comprehensively in this paper. Firstly, the structure and principle of typical micromachined hemispherical gyroscope were introduced, and its advantages over other micromachined gyroscopes were demonstrated Taking a typical micromachined hemispherical gyroscope...
The process of dispensing gel above the silicon chip aimed at protecting chip surface and bonding wire is one of the most critical steps in the production of highly accurate low-pressure sensor modules. Numerous research efforts focused on the influences of dispensing process parameters, configuration and mechanical behavior of cured gel on the performance of sensors, while few concerns were taken...
Graphene sheet (GS) is a two-dimensional (2D) material with extremely favorable mass sensor properties. In this paper, a linear elastic 2D plate model is applied to study the potential of a nanoscale mass sensor on individual GS. The simulated natural frequency was compared with the results obtained from the Rayleigh's energy method. The effects of the attached mass, aspect ratio, and the layer number...
The paper presents an analysis of self-heating effect on micro-machined temperature difference air flow sensor, and demonstrates through modeling and simulation that self-heating effect can influence the output of the air flow sensor. The mathematical model of the sensor based on an existing microsensor chip is set up, and some details of the chip structure are considered in the model. The sensor's...
In this paper, simulation and optimization of a micro flow sensor is presented. Modeling of the micro flow sensor using ANSYS Fluent for temperature distribution is studied. The detailed structure of the micro flow sensor chip is considered in the simulation model. What's more, the temperature dependencies of physical properties of air are defined to improve the model precision. As a key parameter,...
Graphene sheet (GS) is a two-dimensional (2D) material with extremely favorable mass sensor properties. In this paper, a linear elastic 2D plate model is applied to study the potential of a nanoscale mass sensor on individual GS. The simulated natural frequency was compared with the results obtained from the Rayleigh's energy method. The effects of the attached mass, aspect ratio, and the layer number...
The thermal effect on performance of micromachined hemispherical vibratory gyroscope subjected to environment temperature change was investigated comprehensively in this paper. Firstly, the structure and principle of typical micromachined hemispherical gyroscope were introduced, and its advantages over other micromachined gyroscopes were demonstrated Taking a typical micromachined hemispherical gyroscope...
The paper presents an analysis of self-heating effect on micro-machined temperature difference air flow sensor, and demonstrates through modeling and simulation that self-heating effect can influence the output of the air flow sensor. The mathematical model of the sensor based on an existing microsensor chip is set up, and some details of the chip structure are considered in the model. The sensor's...
In this paper, simulation model for the response time of micro flow sensor using COMSOL Multiphysics is presented. The detailed structure of the micro flow sensor chip is considered in the simulation model. What's more, the temperature dependencies of physical properties of air are defined to improve the model precision. The model takes into consideration the transient conduction and convection between...
The process of dispensing gel above the silicon chip aimed at protecting chip surface and bonding wire is one of the most critical steps in the production of highly accurate low-pressure sensor modules. Numerous research efforts focused on the influences of dispensing process parameters, configuration and mechanical behavior of cured gel on the performance of sensors, while few concerns were taken...
The mechanism of resonant frequency shift of MEMS gyroscope subjected to environment temperature change was investigated comprehensively in this paper, and its computational model was set up based on certain assumptions. Taking the structure of MEMS gyroscope as an example using the finite element method, firstly, the authors derived the simplified M-C-K dynamic model. Then, thermal stress and the...
In this paper, we propose a pressure sensor using strain gages bonded on 17-4PH stainless steel (SS) diaphragm based on micro-fused glass frit technology. The strain gages with uniform resistance are obtained by growing an epi-silicon layer on a single crystal silicon wafer using epitaxial deposition technique rather than conventional photolithography and etching techniques. The inorganic micro-fused...
The present paper is focused on the characteristics study of thermal flow sensors in different shapes. Based on the thermal flow sensor design theory, a series of thermal flow sensors with different shapes were developed. Compared with the existing model, the sensitivity of the curve design was also studied through thermal analysis. The results reveal different temperature distributions in different...
The attachment of the silicon piezoresistive pressure sensor die to the substrate is one of the most critical steps in the production of highly accurate pressure sensor. In this paper, single parameter of the adhesive affecting the silicon piezoresistive pressure sensor's output characteristics has been studied. Shear strength of the adhesive with optimized parameters also has been evaluated. Material...
The piezoresistive pressure sensor is one of the major applications of MEMS (Micro-Electro-Mechanical-System) devices. Nowadays, in the field of automotive electronics, silicon-based pressure sensors are playing a significant role in the control of brake, engine, tire pressure, etc. The piezoresistive based engine oil pressure sensor mentioned in this paper is applied to detect the pressure of lubricant...
In this paper, a platinum thin film thermal flow sensor was presented. Design, fabrication process and thermal analysis were presented and discussed. Compared with traditional structure of four supporting beams, the present structure can provide high sensitivity and good strength because of the unique thermal and mechanical design. The sizes of the flow sensor chip are 571 μ m × 280 μ m × 0.25 μ m...
The die of piezoresistance based pressure sensor and its driving circuits has been integrated into one printed circuit board which is specially designed. Then the whole PCB is packaged into a metal shell by SIP technology and special packaging techniques to form a full pressure sensor. Tests have proved that this kind of pressure sensor has good performance. Compared with traditional pressure sensors,...
A unique feature of sensor networks is the capability of performing actions in response to events detected by sensors. Such a feature requires a mechanism to create an association between the sensor and the actuator, and the resulting association is called a binding. The ZigBee specification defines default binding mechanism called end-device binding. However, this binding mechanism allows only a...
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