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The mechanism of resonant frequency shift of MEMS gyroscope subjected to environment temperature change was investigated comprehensively in this paper, and its computational model was set up based on certain assumptions. Taking the structure of MEMS gyroscope as an example using the finite element method, firstly, the authors derived the simplified M-C-K dynamic model. Then, thermal stress and the...
Due to its many advantages over traditional 3D packaging technology, through silicon via (TSVs) is being widely used. However, there are still a variety of obstacles hindering it from being developed rapidly. One of them is the huge thermal stress induced by big CTE mismatch between silicon and copper, which would even induce interfacial delamination. In this paper, thermal stress is evaluated first...
Previous researchers usually set a constant heat transfer coefficient (HTC) for the surface heat exchange according to experience or empirical formulas to investigate the distribution of temperature and stress in their thermo-mechanical analysis, but this method does not satisfy the real condition since HTC may not be the same as people assume especially when the size is very small. Moreover, HTC...
In this paper, in order to improve the reliability of LED module, the accelerated life test (ALT) for LED was conducted. Experimental measurements were adopted to obtain the temperature variations of LED module. In the experiment, the LED samples are placed in the chamber to conduct the thermal shock between −40°C and 125°C. The powered and unpowered experiments of LED were both tested. The luminous...
The attachment of the silicon piezoresistive pressure sensor die to the substrate is one of the most critical steps in the production of highly accurate pressure sensor. In this paper, single parameter of the adhesive affecting the silicon piezoresistive pressure sensor's output characteristics has been studied. Shear strength of the adhesive with optimized parameters also has been evaluated. Material...
As the power density enhances while package size decreases, thermal management becomes a primary concern of the reliability and performance of the electronic packaging. When the natural convective heat transfer can't meet the thermal budget, a forced convective heat transfer must be employed in order to prevent the inappropriate temperature and thermal induced stress which would cause many problems...
Undesired thermal residual stresses and strains always exist in GaN epitaxial film after the process of metal organic chemical vapor deposition (MOCVD) due to difference in thermal expansion coefficients between the silicon substrate and epitaxial layer. These stresses would mostly result in defects such as dislocations, surface roughness, and even cracks in epitaxial layer preventing further device...
Due to large mismatch in coefficients of thermal expansion between the copper via and the silicon of Through Silicon Via(TSV), significant thermal stresses will be induced at the interfaces of copper/dielectric layer (usually SiO2) and dielectric layer/silicon when TSV structure is subjected to subsequent temperature loadings, which would influence the reliability and the electrical performance of...
Multi-physics multi-scale modeling issues in various stages of the LED manufacturing, 3D-SiP, and nano interconnects have been discussed. Molecular dynamics (MD) and finite element method (FEM) have been used to study the scale effect of the material properties and the prediction of the module behaviors which are critical to LED fabrication. We propose a new concept to integrate multi-physics/multi-scale...
In this paper, a non-linear and one-directional coupled finite element framework has been implemented to simulate induction heating process of wafer-level packaging. Based on numerical results of induction heating, thermally-caused warpages and stresses of the single-sided ceramic wafer have been evaluated. Some primary experiments have also been conducted to verify the numerical method. Using three-dimensional...
More and more research has been done on tire pressure monitoring system (TPMS) with the rapid development of automobile industry and increasing public attention to automobile safety. It is generally known that suitable tire pressure is a critical factor in the safe operation, tire wear, gas mileage and performance of a motor vehicle. It is also important to reduce maintenance and logistic cost of...
In this paper, we demonstrate a packaging method for component of light emitting diode (LED) by silicon bulk micromachining technologies and using a silicon substrate with Cu/M/Cu foil to dissipate heat and match thermal expansion coefficient (CTE). The objective is to develop an LED package that can overcome high brightness LED life, high operating current and the ability to drive the devices at...
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