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Cu pumping is defined as the irreversible extrusion of Cu from Cu-filled through-silicon vias (TSVs) exposed to high temperatures. The distribution of Cu pumping values over the TSVs of a single wafer has a large intrinsic spread. In previous publications both a lognormal distribution and a distribution of the maximum of two normal variables were used to fit experimental data. In this paper, these...
Cu pumping is the irreversible extrusion of Cu from Cu-filled through-silicon vias (TSVs) exposed to high temperatures during back-end of line (BEOL) processing. The distribution of Cu pumping values over the TSVs of a single wafer has a large intrinsic spread. As potential BEOL reliability issues due to Cu pumping will first occur at the highest pumping TSVs, they can be mitigated if the fundamental...
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