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In plane collective bonding by NCF-TCB with the film inserted between the die and the substrate, which had a significant potential to enhance the productivity, was studied. PTFE and the newly developed film which consisted of thermosetting resin layer were evaluated as the insertion films. The performance of the bonding force leveling was evaluated. Bonding was carried out by the intentionally inclined...
Liquid epoxy resin is used in various types of mobile information equipment and devices and expected to be a key material for flip chip packaging [1-2]. The flip chip connection process is a thermo-compression molding process. In this process, air voids may remain behind due to the bump shape and resin properties; therefore, an appropriate molding condition is necessary. We developed a computer-aided...
A tunable optical dispersion compensator that uses cascaded arrayed-waveguide gratings and integrated phase shifter is reported. It is reflective configuration but does not require a circulator. The dispersion is successfully controlled from +142 to +1148 ps/nm.
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