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This paper studies the challenges and behavior of epoxy material between the silicon (Si) material and roughened Ni/Pd/Au-Ag alloy-plated Copper (Cu) leadframe (known as μPPF) with anti-epoxy bleed-out (EBO) during die bond process. Die bond on die attach paddle (DAP) of roughened μPPF using Silver (Ag)-based epoxy has been a challenge for its manufacturability in terms of maintaining the target epoxy...