The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The fabrication of a smart interposer for millimeter wave applications is described in this article. The process flow and fabrication steps are presented. A special focus is made on the electrical characterization of a specific backend routing lines and the wafer level molding material laminated on the interposer. RF properties up to 67 GHz are reported: the backend routing CPW lines exhibit an attenuation...
Energy-efficiency is of paramount importance in modern battery-powered wireless communication devices in order to provide longer talk-time and autonomy. At the radio level, the power amplifier is a major contributor to the power consumption, especially with recent non-constant envelope modulations requiring stringent linearity. Another energy efficiency issue arises at the antenna level in miniature...
This paper presents a fully integrated 60GHz transceiver module in a 65nm CMOS technology for wireless high-definition video streaming. The CMOS chip is compatible with the WirelessHD™ standard, covers the four channels and supports 16-QAM OFDM signals including the analog baseband. The ESD-protected die (9.3mm2) is flip-chipped atop a High Temperature Cofired Ceramic (HTCC) substrate, which receives...
This paper presents two feeding techniques for the radiation characterization of integrated antennas at millimeter-wave frequencies. The first method involves feeding the antenna-under-test (AUT) with a RF probe. We compare the measurements obtained with a standard RF probe, an extended probe and an extended probe with reversed connector orientation. We find that the reversed orientation probe produces...
Heterogeneous integration of different technologies is increasingly required in microsystems integration. This entails the need of both technology development and new design methodologies. This work realized a high-performance Ku-band SiP Doppler radar demonstrator based on the combination of technologies and design methodologies.
Heterogeneous integration of different technologies is increasingly required in microsystems integration. This entails the need of both technology development and new design methodologies. This work realized a high-performance Ku-band SiP Doppler radar demonstrator based on the combination of technologies and design methodologies.
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.