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A 6.5×6.5 mm2 compact silicon interposer encompassing 2 Tx/Rx antenna, one RF chips, TSV via-last has been designed and fabricated for 60 GHz fast data transmission applications. First characterizations are described in this paper with a focus on reliability, antenna performances and Through-Silicon-Vias (TSV) characterization. It is first shown that more than 500 thermal cycles can be achieved with...
The fabrication of a smart interposer for millimeter wave applications is described in this article. The process flow and fabrication steps are presented. A special focus is made on the electrical characterization of a specific backend routing lines and the wafer level molding material laminated on the interposer. RF properties up to 67 GHz are reported: the backend routing CPW lines exhibit an attenuation...
With the tremendous development of wireless applications, new communication systems are emerging in the 3DIC microelectronic manufacturing. Many of them integrate the interposer technology in order to efficiently associate heterogeneous devices such as transceivers and antennas. Those devices are electrically connected by means of interconnections achieved within an interposer platform which constitutes...
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