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In this paper we introduce a novel error resilient memory architecture potentially applicable to a large range of memory technologies. In contrast with state of the art memory error correction schemes, which rely on (extended Hamming) Error Correcting Codes (ECC), we make use of Low Density Parity Check (LDPC) codes due to their close to the Shannon performance limit error correction capabilities...
In this paper we propose a novel error correction scheme/architecture specially tailored for polyhedral memories which: (i) allows for the formation of long codewords without interfering with the memory architecture/addressing mode/data granularity and (ii) make use of codecs located on a dedicated tier of the 3D memory stack. For a transparent error correction process we propose an online memory...
3D-Stacked IC (3D-SIC) based on Through-Silicon-Vias (TSV) is an emerging technology that enables heterogeneous integration and high bandwidth low latency interconnection. In this paper we propose a 3D novel cache architecture that leverages a wide TSV-based data link distributed on the entire memory array to support two orthogonal interfaces: (i) a vertical one, with a large data width, and, (ii)...
In this paper we propose to utilise 3D-stacked hybrid memories as alternative to traditional CMOS SRAMs in L1 and L2 cache implementations and analyse the potential implications of this approach on the processor performance, measured in terms of Instructions-per-Cycle (IPC) and energy consumption. The 3D hybrid memory cell relies on: (i) a Short Circuit Current Free Nano-Electro-Mechanical Field Effect...
3D-Stacked IC (3D-SIC) based on Through-Silicon-Vias (TSV) is an emerging technology that provides many benefits such as low power, high bandwidth 3D memories and heterogeneous integration. One of the attractive applications making used of such benefits is the stacking of memory dies on logic. System integrators for such application have to provide appropriate test strategy. However, they have to...
In this paper, we address the design of wide-operand addition units in the context of the emerging Through-Silicon Vias (TSV) based 3D Stacked IC (3D-SIC) technology. To this end we first identify and classify the potential of the direct folding approach on existing fast prefix adders, and then discuss the cost and performance of each strategy. Our analysis identifies as a major direct folding drawback...
In this paper, we introduce a Nano-Electro-Mechanical Field Effect Transistor (NEMFET) based logic family tailored to the implementation of low speed and ultra low energy functional units and processors. Basic Boolean gates implemented with NEMFETs only are analysed and compared against equivalent CMOS realisations. Our simulations suggest that the proposed short-circuit current free NEMFET gates...
Achieving dependable computing systems is becoming increasingly more difficult as CMOS integrated circuits technology scaling reaches sub-22nm ranges and faces physical limitations. Dependable computing is also a major concern with the various new technologies that are being investigated to overcome the physical limitations of CMOS technology. 3D integration, though initially proposed as a way of...
In this paper we present a zero-performance-overhead online fault detection and diagnosis scheme that exploits the vertical proximity of hardware inherent in 3D stacked integrated circuits (3D-SIC). We consider a 3D stacked processor executing independent instruction streams from different threads, on each die. We propose the vertical clustering of functionally identical computational blocks in order...
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