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The International Technology Roadmap for Semiconductors (ITRS) is probably the single most important document governing the direction of the semiconductor manufacturing industry. The Factory Integration (FI) chapter seeks to define a roadmap for semiconductor factories and enterprise systems. This roadmap has gone through a significant revision over the past 2 years with a focus on commonality, integration,...
In semiconductor manufacturing, the implementation of advanced process control systems has become essential for cost effective manufacturing at high product quality. In addition to established process control methods, new control techniques such as virtual metrology, where post-process quality parameters are predicted from process and wafer state information need to be developed and implemented for...
Leakage current of silicon (Si) based diodes could be reduced by a factor of 1.,000 while using Thermal Laser Separation (TLS) compared to state-of-the-art mechanical blade dicing. Laser based heating and subsequent water spray cooling is used to induce a mechanical stress field inside the Si-wafer guiding a crack along a line to be cut without melting or removing material. Results of physical and...
Feature sizes of transistors manufactured on silicon wafers in high volume reached 22 nm and will further decrease in the future. Superior wafer surface quality is mandatory to produce such small feature sizes. One relevant quality parameter is the nanotopography of the wafers surface. Applying dedicated state-of-the-art metrology systems, nanotopography is characterized end-of-line of wafer manufacturing...
In semiconductor manufacturing, advanced process control systems have become essential for cost effective manufacturing at high quality. Algorithms for new control methods such as virtual metrology where post process quality parameters are predicted from process and wafer state information need to be developed and implemented for critical process steps. The objectives of virtual metrology application...
This paper presents a comparison of three algorithm types (Bayesian Networks, Random Forest and Linear Regression) for Predictive Maintenance on an implanter system in semiconductor manufacturing. The comparison studies are executed using a Virtual Equipment which serves as a testing environment for prediction algorithms prior to their implementation in a semiconductor manufacturing plant (fab). The...
Within the ENIAC project “IMPROVE”, new algorithms for virtual metrology and predictive maintenance are being developed to substantially enhance efficiency in European semiconductor manufacturing. The consortium comprises important IC manufacturers in Europe, solution providers, and research institutions. A major objective of the project is to make these new APC methods applicable in the existing...
This paper presents a Virtual Equipment which serves as a testing environment for evaluating Virtual Metrology (VM) algorithms prior to their implementation into semiconductor fab structures. The Virtual Equipment merges statistical simulation with physical simulation to generate test data sets for various common and uncommon states of the processing equipment. The input data is based on historical...
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