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Wire bonding is still the dominating technology for realizing the first level contact of semiconductors. In the last decades miniaturization and increasing connection density resulted in new challenges in terms of reliability and long term stability. But now additionally the movement towards harsher application environments leads to new problems due to aggressive media like oily or salty atmosphere...
Failure analysis and material characterization for power electronics packaging is critical, yet extremely challenging due to the large variety of technologies and materials employed. The current paper presents two case studies describing how defects at the nano-and microscale can greatly impact the performance and functionality of the entire power module. The first example correlates the microstructure...
Within this paper the application potential of a new fast Plasma FIB system for defect analysis regarding packaging reliability studies is evaluated. Depending on the material under investigation both the higher current and the higher sputter efficiency of the Xe significantly improve the range of application fields and/or the analysis throughput. This makes the Plasma FIB a very attractive tool for...
Ultrasonic heavy wire bonding is one of the most relevant interconnection technologies in automotive and power electric devices. The reliability of electronic components in these fields is mainly determined by the interconnection lifetime during application and, thus by the strength and fatigue characteristics of the mechanically and thermo-mechanically loaded bonding wire materials. In the current...
The paper demonstrates that new failure modes can be analyzed and understood if an improved comprehensive flow in diagnostics involving non-destructive failure localization, ion-beam-supported target preparation, high-resolution electron microscopy and ultra-sensitive surface analytics are implemented in the physical failure analysis chain. For illustration, the potential of combining new non-destructive...
The paper focuses on electron microscopy investigations of board assembly for a new XFLGA package with emphasis on microstructure, intermetallic compound (IMC) and defect formation in solder to package and board metallization interfaces. XFLGA packages with NiAu lead finish were assembled using a commercial SnAg3.5Cu0.7 solder to NiAu- or CuOSP board metallization. The interface microstructure was...
Different methods for characterizing the local plastic deformability of small Al bonding wire samples were presented including Vickers and spherical indentation as well as micro compression testing for two different sample orientations. The results were compared to reference data derived from tensile testing of macroscopic wire specimens and to the Al grain microstructure as characterized by the electron...
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