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Physically meaningful and easy-to-use analytical predictive stress models are developed for a through-silicon-via (TSV) design using theory-of-elasticity based approach. Two extreme cases of the TSV height-to-diameter ratios are considered: disc-like vias, with the aspect ratios below 0.25 (plane stress approximation can be employed in this case), and rod-like-vias, with aspect ratios, above 2.5 (plane...
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