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This paper presents a 3D circuit model capable of rapidly and accurately evaluating substrate noise coupling in the context of 3D integration. Since TSVs are large and noisy structures, the evaluation of electromagnetic coupling to and from TSVs has become crucial to the design of threedimensional integrated circuits. In this work, we present a fast and accurate 3D circuit model to this end. The model...
3D technologies provide promising solutions to meet the needs of today's high performance and high speed ICs. Therefore, a methodology is required to model, predict, and optimize the 3D interconnect performance. This paper focuses on modeling of the performance of 3D interconnect test structures, realized on Si substrates, both in the time frequency domains. In particular, the impact of the Si substrate...
3D stacking of dies is a promising technique to allow miniaturization and performance enhancement of electronic systems. The complexity of the interconnection structures, combined with the reduced thermal spreading in the thinned dies and the poorly thermally conductive adhesives complicate the thermal behavior of a stacked die structure. The same dissipation will lead to higher temperatures and a...
We describe the design challenges for a low-cost 130nm 3D CMOS technology with 5μm diameter at 10μm pitch Cu-TSV. We investigate electrical, thermal and thermo-mechanical issues encountered in 3D. The electrical yield and ESD of TSVs is reviewed and designers are advised how to ensure yield and reliability. For thermal and thermo-mechanical we'll indicate based on experimental characterization, the...
The paper describes the design challenges for a low-cost 3D Cu-TSV technology. Based on experimental characterization, we'll indicate the importance of extending the chip package co-design flow with thermo-mechanical simulations of the chip stack. We propose a new design flow hereto which leverages information captured by “smart mechanical samples” .
3D stacking of dies is a promising technique to allow miniaturization and performance enhancement of electronic systems. Key technologies for realizing 3D interconnect schemes are the realization of vertical connections, either through the Si-die or through the multilayer interconnections. The major bottleneck for 3D integration are thermal management issues due to the reduced thermal spreading in...
New technologies for manufacturing 3D Stacked ICs offer numerous opportunities for the design of complex and efficient embedded systems. But these technologies also introduce many design options at system/chip design level, hard to grasp during the complete design cycle. Because of the sequential nature of current design practices, designers are often forced to introduce design margins to meet required...
3D stacking of dies is a promising technique to allow miniaturization and performance enhancement of electronic systems. Key technologies for realizing 3D interconnect schemes are the realization of vertical connections, either through the Si-die or through the multilayer interconnections. The complexity of these structures combined with reduced thermal spreading in the thinned dies complicate the...
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