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The semiconductor industry is demanding miniaturization coupled with increased functionality from microelectronic packages. Ultra-thin molded array packages (TMAP) with package thickness ≤ 500 µm are desirable for applications where system integration space is limited. Such ultra-thin packages require careful selection of the epoxy molding compound (EMC) to control strip level and package level warpage...
Industry migration to leadfree solders has resulted in a proliferation of a wide variety of solder alloy compositions. The most popular amongst these are the Sn-Ag-Cu family of alloys like SAC105 and SAC305. Electronics subjected to shock and vibration may experience strain rates of 1–100 per sec. Electronic product may often be exposed to high temperature during storage, operation and handling in...
Leadfree solders have been used as interconnects in electronic packaging, due to its environmental friendly chemical property. However, those materials may experience high strain rates when subjected to shock and vibration. Consequently, failure will occur to electronics in those situations. Therefore, knowing the material properties of lead-free solders are extremely important, but research on mechanical...
Electronics subjected to shock and vibration may experience strain rates of 1–100 sec−1. High strain rate data is scarce for leadfree solders at strain rates in the range of 1–100 sec−1, typical of drop-impact, shock and vibration. A new experimental method has been developed to achieve constant strain rate in the neighborhood of 1 to 100 sec−1 during the entire deformation history. SAC105 and SAC305,...
Electronic products are subjected to high G-levels during mechanical shock and vibration. Failure-modes include solder-joint failures, pad cratering, chip-cracking, copper trace fracture, and underfill fillet failures. The second-level interconnects may be experience high-strain rates and accrue damage during repetitive exposure to mechanical shock. Industry migration to leadfree solders has resulted...
Electronics may experience high strain rates when subjected to high g-loads of shock and vibration. Material and damage behavior of electronic materials at high strain rates typical of shock and vibration is scarce. Previously studies have shown that second-level interconnects have a high propensity for failure under shock and vibration loads in fine pitch electronics. Exposure to shock and vibration...
Electronic products are subjected to high G-levels during mechanical shock and vibration. Failure-modes include solder-joint failures, pad cratering, chip-cracking, copper trace fracture, and underfill fillet failures. The second-level interconnects may be experience high-strain rates and accrue damage during repetitive exposure to mechanical shock. Industry migration to leadfree solders has resulted...
Electronic products are subjected to high G-levels during mechanical shock and vibration. Failure-modes include solder-joint failures, pad cratering, chip-cracking, copper trace fracture, and underfill fillet failures. The second-level interconnects may be experience high-strain rates and accrue damage during repetitive exposure to mechanical shock. Industry migration to leadfree solders has resulted...
Electronic packages subjected to drop and shock have been simulated using alternative theory known as peridynamic theory in the realm of FEM. In peridynamics, problems are formulated in terms of integral equation which is a substitute to conventional solid mechanics theory where problems are formulated in terms of partial differential equations. This alternative approach is more potent than conventional...
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