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A local bending stress is induced by coefficient of thermal expansion (CTE) mismatch between underfill material and metal microbumps in three-dimensional IC (3D IC). A high concentration of filler in underfill is effective to suppress the local bending stress. However, it is difficult to apply high concentration of filler due to fine pitch microbumps. On the other hand, manganese nitride-based compound...
Three-dimensional IC (3D IC) is a promising method to enhance IC performance. Conventional 3D ICs consist of vertically stacked several thin IC chips those are electrically connected with lots of through-Si vias (TSVs) and metal microbumps. Metal microbumps are surrounded by organic adhesive. An epoxy-based material, so-called underfill, has been widely used to fill the gap between several chips....
Three-dimensional IC (3D IC) has attracted much attention as a promising method to enhance IC performance. Recently, great interests in mechanical reliability are increasing among 3D IC researchers for production of 3D IC. Conventional 3D ICs consist of vertically stacked several thin IC chips those are electrically connected with lots of through-Si vias (TSVs) and metal microbumps. Metal microbumps...
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