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DRAM speed already reaches 7Gb/s/pin for GDDR interface [1,4]. As the bit rate increases, jitter of PLL, data-sampling margin, crosstalk and intersymbol interference (ISI) needs considerable management [1,3,5]. Moreover, as the supply voltage decreases, the self-generated internal noise of DRAM increases due to low efficiency of the internal voltage generator, especially the VPP voltage generator...
Among the stacked dies using through silicon via (TSV), data conflictions occur due to process mismatches, which decrease the data valid window and consume unwanted power due to the short circuit current. This paper presents the DLL-based data self-aligner (DBDA), which reduces data conflictions among stacked dies. The stacked dies employing the proposed DBDAs automatically align their data output...
The process variation among 512 DRAM samples is more than 30% [1]. The performance variation of general circuits is predicted to be over 60% in 2012 [2]. In general, a single-die-based DRAM has a large process variation from chip to chip, which among other parameters, causes tAC (address access time) variation in the application system. In order to reduce the tAC variation, most highspeed SDRAMs adopt...
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