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CAD sybsystem for logi-thermal analysis of the digital circuits is presented. Logical circuits are described by VHDL language. Thermal regimes are calculated by electro-thermal analogy method. For the calculation of the thermal resistances and capacitances the thermal 3D simulator Overheat-IC based on semi-analytical solution of three-dimensional heat conduction equation is used. For simultaneous...
New quasi - 3D numerical model for thermal analysis of the BGA packages is presented. The general 3D heat transfer problem is correctly transformed to the set of 2D equations for temperature distributions in different layers of the package. The complexity and CPU time of the thermal analysis are many times reduced. The results of BGA package thermal modeling are presented.
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