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This manuscript investigates thermal performance of x-dimension (x-dim) passive components, during operation and soldering by means of 3D FEM thermal simulations and experiments. X-dim components feature standardized height, double-sided SMT terminations, and improved thermal behaviour and can be stacked between PCBs to achieve 3D spatial layout. During components operation, standard passives with...
Reliability prediction according to reliability standards is often applied to estimate the reliability of electronic systems. Failure rates are typically dependent on their stress conditions (predominantly thermal and electrical stresses). However, getting the exact temperature and stress value for every single component is extremely time consuming, or sometimes impossible. Here the sensitivity of...
Pyroelectric generators (PEGs) present a potential alternative to thermoelectric generators (TEGs), to generate electric power from thermal fields. Pyroelectric generators have a predicted upper limit of 50 % of the Carnot's efficiency, which exceeds that of TEGs. However, PEGs require an oscillating thermal field or thermal vibrations. Such vibrations are rare in technical systems, hindering their...
We present for the first time a bistable thermopneumatic actuator that is based on thermoelectric temperature control. This concept shows several advantages over common thermopneumatic actuators: Due to an active cooling, the reaction time is decreased. Further, positive and negative displacements of the membrane are enabled and allow for a bistable switching. A novel fabrication technology is established...
This paper proposes a multipurpose platform with standard thin-film CMOS fabrication technology for thermocouples for many materials and a high integration density. The heat flow path is perpendicular to the chip surface (cross-plane) and guided by special thermal connectors. On the thermocouples, a grid structure with thermally insulating SU-8 and electrodeposited metal stripes connects one junction...
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