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In the present study, high density TSV structures have been designed and fabricated with different diameter and depths, ranging from 2 to 60 μm and 50 to 100 μm respectively. The ratios of TSV diameter to space between TSVs are 1:2, 1:3 and 1:4. Inspection of TSV structures at each processing step is very crucial to proceed to next step. 3D X-ray CT scan analysis has been employed to inspect TSV wafers...