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The electromigration (EM) performance of pristine and ZrO2 doped Sn58Bi solder was studied using line-type structure, in order to reduce current crowding at the solder/pad interface. Cu/solder/Cu interconnects were applied with a direct current of 2.5 A, which generated a current density of 7.96×103 A/cm2, and stored in an oven at a temperature of 70 °C. After 300 hours current stressing, samples...
In recent years, the manufacturing industry of distribution transformer (DT) in China develops rapidly with high competition. Since the pass rates of National Surveillance Sampling in China (NSSC) for DTs keep a low level, the quality is worried. During the 13th Five-Year Plan period, the investment of distribution network construction will reach 1.7 trillion RMB, which makes a big market for DTs...
In this paper, we proposed the computer vision and behavior imaging science and technology into the field of treatment of children with special needs, aiming to use computer algorithms to automatically analyze children's gaze, and further investigate children's behavior patterns and distinguish whether children are with autism characteristics in our CSBS video. We perform a series of image processing...
The microstructural evolution and interfacial reactions of the eutectic In-48Sn solder interconnect with Cu and Au/Ni/Cu pads, under current stressing of 0.7×104 A/cm2 at room temperature, have been investigated. The Ni metallization eliminated the current density inside the solder bump region, which is helpful to improve the electromigration reliability. During electromigration, Sn migrated to anode,...
In this study, the effect of pad shape on current density and temperature distributions in solder joints has been investigated by three dimensional thermo-electrical finite element analysis. The simulation results show that square, hexagonal, octagonal and rounded pads with the same thickness/volume generate different current density and temperature distributions. The maximum current densities in...
This study focuses on the development of a highly reliable solder bumping solution by the optimization of bump height and shape for flip-chip mounting of large die directly on PCB without the use of underfill. To achieve the goal, an elongated solder joint with an optimized shape has been developed that demonstrated far superior board-level thermo-mechanical reliability to that of the conventional...
The occurrence regulation of Spodoptera litura was studied according to the continiuous years's data investigated in tobacco fields and weather data of Chenzhou and Ningyuan in Hunan. Results showed that generations of Spodoptera litura are 4–4.5 with the effective accumulated temperture per year and the actual generations of Spodoptera. litura is in accordance with the predicted generations in Hunan...
In this study, we use paired data of 281 employees and 36 human resource managers of 36 enterprises in Yangtze River delta of China to test the relationship between incentive compensation and employees' negative behaviors and the moderating effect of organizational commitment. The results show that: incentive pay has significant negative influence on employees' neglect and exit behavior. For employees...
In this paper, a novel nano-scale conductive film which combines the advantages of both traditional anisotropic conductive adhesives/fllms (ACAs/ACFs) and nonconductive adhesives/fllms (NCAs/NCFs) is introduced for next generation high-performance ultra-fine pitch packaging applications. This novel interconnect film possesses the properties of electrical conduction along the z direction with relatively...
In this paper, a novel nano-scale conductive film which combines the advantages of both traditional anisotropic conductive adhesives/films (ACAs/ACFs) and nonconductive adhesives/films (NCAs/NCFs) is introduced and developed for next generation high performance ultra-fine pitch packaging applications. This novel interconnect film possesses the properties of electrical conduction along the z-direction...
Summary form only given. Although conductive adhesives have been studied for many years as a lead-free for electronic interconnect are limited to low voltage display driver devices. This is due to the serious concerns associated with the long-term reliability and high voltage application issues caused by the silver migration, hi this study, a novel approach to reduce silver migration and enhance the...
Although conductive adhesives have been studied for many years as a lead-free alternative in electronic industry, applications of electrically conductive adhesives (ECAs) for electronic interconnect are limited to low voltage display driver devices. This is due to the serious concerns associated with the long-term reliability and high voltage application issues caused by the silver migration. In this...
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