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A DC bias board with 9 separate output voltages is proposed for high precision and noise sensitive measurements. The measured results demonstrated an improved baseband noise up to 30 dB at 20 kHz compared with the laboratory power supplier. A voltage-controlled oscillator (VCO) in CMOS is used to benchmark the impact of power supply noise on circuit performance. The proposed bias board achieves a...
This study is based on International Electrotechnical Commission (IEC) 61967-4 standards for measuring electromagnetic emissions and interferences at the chip level. Conventional measurement methods using fixed SMA connectors were replaced with an improved radio frequency current probe featuring semi-rigid coaxial cables, making it capable of taking mobile measurements, enhancing the flexibility and...
Two on-chip electromagnetic compatibility (EMC) solutions realized in the standard 0.18 μm CMOS technology are proposed. A slew rate controller for electromagnetic interference (EMI) reduction is demonstrated by increasing the rise and fall time of signal to lower the harmonic energy on FFT spectrum. Besides, a MOS plus MOM decoupling capacitor for both EMI and electromagnetic susceptibility (EMS)...
Considerable wind resources are aggregated on Taiwan west coasts that adjacent to Taiwan Strait, it promotes the domestic government to develop the off-shore wind farms for the applications of renewable energy. The first MW level wind turbine testing site that be connected to the 11.4 kV distribution system is also under construction in Taiwan, which is expected to provide testing and certification...
A current probe based on IEC standard 61967-4 is proposed to investigate the conducted electromagnetic emission of IC above 1 GHz. The 1 Ω method in direct coupling method is revisited, and the concern for extending frequency range is discussed. The critical resistive network of 1 Ω probe is realized by a semiconductor process instead of the SMD resistors. With the advantage of reduced parasitic effect,...
A multifunction test board is designed for a microcontroller (MCU) testing. This board can be used to verify the function of the MCU by running several basic instructions. Furthermore, six different IC-EMC measurements complied with IEC standards can be performed on the same board by careful design and the preservation of test points with certified off-board probes. The experimental results show the...
An off-board direct RF power injection (DPI) method using a probe is proposed to investigate the IC immunity. The details of the measurement setup are outlined in this works. We also reviewed the conventional DPI method in addition to a discussion on the limitation of the test printed circuit board. The 3 dB bandwidth of this proposed probe is confirmed. A low dropout regulator (LDO) is used to compare...
In the design of traditional IC only take into the effect of IC and load board, but ignored the effect of testing sockets during testing. With testing frequency get higher and higher, signal will easily have signal integrity (SI) problem. Higher frequency couldn't achieve goal because of the loss on the transmission path. And the most easily part cause loss was the impedance matched socket. To overcome...
Two-dimensional finite difference time domain (2D-FDTD) method is a very powerful electromagnetic numerical method for simulating electromagnetic(EM) problems of a complicated printed circuit board (PCB). However, due to the lack of transversal components of electric field intensities, it is hard to contain the coupling effect among isolated power/ground islands. In order to simulated the EM performance...
The practical approach to implement a 1 Ω current probe with verification for measuring the IC conducted emission is proposed. The 1 Ω/150 Ω direct coupling method is reviewed and the considerations on improving the applicable bandwidth of 1 Ω method are discussed. The critical component, 1 Ω resistor which dominates the frequency response, is designed. The realized 1 Ω probe was fully certified with...
The direct RF power injection (DPI) measurement up to 18 GHz is proposed to investigate the IC immunity. The DPI method is reviewed and the consideration of extending frequency range is discussed. Furthermore, the details of the measurement setup are depicted in this work. The critical part, on-board injection network in the power injection path with a 3 dB bandwidth of 18.7 GHz is realized. A low...
As VLSI techniques are getting more and more advanced, the size of the power grid network increases dramatically. Therefore, the power grid analysis becomes a challenging task during the design procedure. This work utilizes the macromodeling technique [1] and enhances the Orthogonal Matching Pursuit (OMP) based method [2] to develop an effective and robust incremental analysis method for the power...
The evaluation flow for estimating the EMC behavior of RF ICs is proposed. Conducting the electronic design automation (EDA) tools, the evaluation flow naturally embeds in the conventional RF IC design flow and extracts the resistor, inductor, and capacitor components of the network efficiently. The results of the evaluation flow help the IC designer to generate the integrated circuit emission model...
This paper presents a white LED backlight driving chip with 3-bit dimming controller and duty-variable power MOS which can be modified with the voltage-mode pulse width modulation (PWM). In the proposed chip, a 3-bit digital-to-analog converter (DAC) and a ramp generator are used to provide eight pulses with variable width through a voltage comparator. Thus, a 3-bit dimming controller can be implemented...
This paper discuss about System in Package (SIP) about Package on Package (POP). When the signals transmit, the staked substrate between upper and nether will cause the Electromagnetic Interference (EMI) which makes the performance of the circuit become worse. The purpose of this research is to establish a multi-board structure and use it to simulate the EMI of the POP packages. To discuss whether...
This paper presents the design and implementation on a new architecture of broadband network system which suitable for asymmetric digital subscriber line (ADSL) application. The main design skill is based on the cell-based digital IC design process, and is implemented in 0.18 μm 1P6M CMOS process. The main function of this chip is to build a bridge between Ethernet and ATM which is used to substitute...
In this paper, simplified models and simulation of radiated far-field emission from a printed circuit board (PCB) are discussed. Furthermore, a study of radiated far-field emission for an equivalent PCB model is presented. The behaviour between simulated far-field EMI spectra and experimental results keeps the same trend.
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