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Three-dimensional (3-D) memory stacking is one of the most promising solutions to tackle memory bandwidth problems in chip multiprocessors. In this work, we propose an efficient runtime 3-D cache management technique which not only takes advantage of the low memory access latency through vertical interconnections, but also exploits runtime memory access demand of applications which varies dynamically...
Three-dimensional (3-D) memory stacking can resolve memory bandwidth challenges in chip multi-cores by stacking multiple dies of cache memory via inter-die wires between the stacked memories and multiprocessors. However, high power density (i.e., power dissipation per unit volume) due to the high integration incurs temperature-related problems in reliability, power consumption, performance, and system...
Three-dimensional integration has the potential to increase integration density and to reduce communication latency of chip-multiprocessors (CMPs). However, high power density (i.e., power dissipation per unit volume) due to the high integration incurs temperature-related problems in reliability, power consumption, performance, and system cooling cost. In this paper, we propose a design-time solution...
3-D integration is a new technology that overcomes the limitations of 2-D integrated circuits, e.g., power and delay induced from long interconnect wires, by stacking multiple dies to increase logic integration density. However, chip-level power and peak temperature are the major performance limiters in 3-D multi-core architectures. In this paper, we propose a runtime power management method for both...
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