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As far as components with flip chip interconnects are concerned, one of the popular packaging solutions available in the market is thermally enhanced flip chip ball grid array (TEFCBGA) packages, which target mid to high performance applications. Traditional as it may be, the development of a reliable TEFCBGA package is still a very challenging task. The demands for high electrical performance with...
In this paper, the fine pitch ball grid array (FBGA) assembly with lead free solder was tested under thermal cycling condition. Finite element modeling and simulation was conducted. The microstructure designs of via in pad of substrate and through hole (via) in PCB under the solder joint were simulated. The solder mask definition (SMD) and non-solder mask definition (NSMD) on PCB board side was also...
Since the introduction of Thermally Enhanced Flip Chip Ball Grid Array (TEFCBGA) packages, it has been one of the popular packaging options in the market for mid to high end devices in that it effectively improves both electrical and thermal performance of the product. However, to develop a robust TEFCBGA package with extra large body size of 55 mm ?? 55 mm is a no easy task, especially when it contains...
In this work, five solder materials of Sn-3.0Ag-0.5Cu (SAC305), Sn-2.0Ag-0.5Cu (SAC205), Sn-1.0Ag-0.5Cu (SAC105), Sn-1.0Ag-0.5Cu-0.05Ni (SAC105Ni0.05) and Sn-1.0Ag-0.5Cu-0.02Ni (SAC105M0.02) were tested using tensile loading at room temperature to investigate the Ag content and Ni dopant effect on solder mechanical properties, respectively. In addition, different testing temperature conditions including...
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