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In-situ polymerization of aniline salt within epoxy matrices with various content of polyaniline (PANI) was successfully carried out to prepare PANI/epoxy composites. A flexible PANI/epoxy composite prepared in this fashion reached a high dielectric constant close to 3000, a dielectric loss less than 0.5 at room temperature and 10 kHz. The influence of PANI loading levels on various properties was...
Summary form only given. Although conductive adhesives have been studied for many years as a lead-free for electronic interconnect are limited to low voltage display driver devices. This is due to the serious concerns associated with the long-term reliability and high voltage application issues caused by the silver migration, hi this study, a novel approach to reduce silver migration and enhance the...
Electrically conductive adhesives (ECAs) are a promising alternative for lead-containing solders in electronic packaging. However, the conductivity of ECA is lower than that of solders due to the physical contact between conductive fillers and insulative organic lubricants on Ag flakes. In this study, a group of reducing agents were introduced into a typical ECA formulation. During the curing process,...
A novel, photodefinable, high dielectric constant (high-k) nanocomposite material has been developed for embedded capacitor applications. It consists of SU8 as the polymer matrix and barium titanate (BT) nanoparticles as the tiller. The UV absorption characteristics of BT nanoparticles were studied with a UV-Vis spectrophotometer. The effects of BT nanoparticle size, filler loading, and UV irradiation...
Cobalt ferrite nanocomposite was investigated for RF applications. Magnetic nanocomposites were fabricated at different ferritic densities. Cobalt zinc ferrite nanocomposite was also prepared to study the effect of zinc. The size of magnetic nanoparticle was measured by transmission electron microscopy (TEM), while its crystalline structure was characterized by X-ray diffraction (XRD). Toroidal sample...
Carbon nanotubes (CNTs) have been proposed for applications in microelectronic applications, especially for electrical interconnects and nanodevices, due to their excellent electrical, thermal and mechanical properties. In order to create interconnect structures comprised of CNT units, it is necessary to control the growth of CNTs in predefined orientations and configurations at a temperature compatible...
Carbon nanotubes (CNTs) have been proposed for applications in microelectronic applications, especially for electrical interconnects and nanodevices, due to their excellent electrical, thermal and mechanical properties. Usually, the CNTs produced by arcing, laser ablation or chemical vapor deposition (CVD) are inevitably close-ended. Due to the weak coupling of the individual walls and close ends,...
To improve the electrical properties of electrically conductive adhesives (ECAs), different types of aldehydes, salicylaldehyde and transcinnamaldehyde, were introduced into ECA formulations. During the curing process, the aldehydes acted as a reducing agent and reduced metal oxide in ECAs. At the same time, aldehydes could consume ambient oxygen and prevent the oxidation of the metal fillers in the...
Z-source neutral-point-clamped (NPC) inverter has recently been proposed as an alternative three-level buck-boost power conversion solution with an improved output waveform quality. In principle, the designed Z-source inverter functions by selectively "shooting through" its power sources, coupled to the inverter using two unique Z-source impedance networks, to boost the inverter three-level...
Lead-free and environmentally sound interconnect bonding processes are urgently needed. Among the possibilities are electrically conductive adhesives (ECAs) and lead-free solders (Codenhead, R. and DeCoursy, D., 1985). Compared to soldering technology, ECA technology can offer numerous advantages such as fewer processing steps which reduces processing cost, lower processing temperature which makes...
Although conductive adhesives have been studied for many years as a lead-free alternative in electronic industry, applications of electrically conductive adhesives (ECAs) for electronic interconnect are limited to low voltage display driver devices. This is due to the serious concerns associated with the long-term reliability and high voltage application issues caused by the silver migration. In this...
Traditional DC-AC current source inverter (CSI) has a right-half-plane (RHP) zero in its control-to-output transfer function. This RHP zero causes the inverter output to fall before rising when a step increase in command reference is required (commonly known as non-minimum-phase effect). To achieve a better dynamic response, this paper proposes the design of a tri-state CSI using only an additional...
Tin (Sn) nanoparticles with various sizes were synthesized from a chemical reduction method. Their morphological and thermal characterizations were studied. The high resolution transmission electron microscopy (HRTEM) study showed that significantly low level of oxides was formed. The thermal characterization by differential scanning calorimetry (DSC) exhibited the size dependency of the melting points
In this paper, the novel biocompatible materials were created on the basis of creation of the bio-inert superhydrophobic surfaces using a heat curable polydimethylsiloxane (PDMS, Sylgard 184, a product of Dow Corning) and polytetrafluoroethylene (PTFE) particles. The incorporation of PTFE nanoparticles in the PDMS matrix allows the formulation of superhydrophobic films with contact angles of ~160deg...
Imidazolium salts were explored as novel catalysts for underfill application. The catalytic properties of a series of imidazolium salts with different coordinating anions were studied by a dynamic differential scanning calorimeter (DSC). By changing the counter anions in these catalysts, the curing kinetics of the underfill can be adjusted. To understanding the curing mechanism of imidazolium salt,...
In this study, we have developed high dielectric constant (k>50) embedded capacitor dielectrics with a moderate volume fraction of tiller that show good adhesion, good thermal stress reliability and good large area processibility at low processing temperature (<200degC). Material design and processing are critical to obtain a high dielectric constant composite at a moderate filler loading. The...
Recently, non-conductive adhesive (NCA) bonding technology has attracted increasingly research interests as lead-free interconnect due to the fine pitch capability and low cost. The NCA usually requires no conductive tillers, but needs a relatively high pressure for bonding between the IC chip and the substrate coupled with heat. During bonding, the heat and pressure are applied for some time and...
In order to accommodate environmental considerations, the environmentally friendly and biocompatible materials become increasingly important and attract a lot of research interest in recent years, while application of biocompatible materials are still in its infancy. In this paper, the biochemical building blocks, amino acid is used as a novel environmentally benign and biologically compatible curing...
Due to the surface smoothness of micromachined structures, strong adhesion forces between these fabricated structures and the substrate can be developed. The major adhesion mechanisms include capillary forces, hydrogen bonding, electrostatic forces and van der Waals forces. Once contact is made, the magnitude of these forces is in some cases sufficient to deform and pin these structures to the substrate,...
Recently, anisotropic conductive adhesives (ACAs) have attracted increasing interests as environmentally friendly materials in electronic packaging industry because they are lead-free, require fewer processing steps, such as fluxing and cleaning (reducing processing cost), allow a low processing temperature (enabling the use of heat-sensitive and low-cost components and substrates), and fine pitch...
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