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Lead free SnAgCu solder joints used in surface mount packages like Ball Grid Array (BGA) have a great impact on the reliability of the end product. The mechanical properties of the solder are important factors. By changing the concentration of silver and copper, or by doping a very low portion of the fourth element (e.g. Ni), the strength of solder can be optimized. In this work, the board-level drop...
Failure analysis of lead-free solder joints for PBGA assemblies subjected to thermal cycling aging is reported. A micro-digital image speckle correlation system (Micro-DISC) was employed for micro-deformation and strain analysis. The Sn-3.8Ag-0.7Cu (SAC) soldered assembly was subject to a temperature ramp from room temperature of 25 degC to 125 degC. The growth of interfacial IMC compounds and the...
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