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Time to market is becoming one of the most important factors because of the fierce market competition. However, traditional reliability and interface toughness characterization tests take very long time. For example, moisture sensitivity level assessment (MSL1) will take 168 hours pre conditioning at 85degC/85%RH and tradition thermal cycling takes even longer time. The long preconditioning times...
The possibility to conform microelectronic circuits onto non-planar or even high-curvature surfaces is of increasing interest for future applications. A promising flexible substrate concept based on vertical thinning/lateral partitioning and the substrate transfer technology is developed. Test structures for flexibility testing which consist of a partitioned ultra-thin poly-silicon layer sandwiched...
In this paper, results of experiments and FE simulations on mechanical issues of poly-and single crystalline silicon on ultra-thin polyimide substrates are presented. Formation and propagation of cracks within the silicon and dielectric layers are then studied under controlled bending and tensile tests using bending and tensile tools being custom designed for this purpose. The results show that the...
Initial studies have demonstrated that specially designed and fabricated microelectronics embedded in flexible substrates can maintain functionality when subjected to stretching as well as bending. The acceptable flexibility and stretchability for ultra-thin substrate could be reached by embedding the ultra-thin substrate into flexible polyimide and patterning the silicon into square or hexagon segmentations...
In this contribution, results of our work on reliability issues of ultra-thin poly- and single crystalline silicon layers on thin polyimide substrates under mechanical deformations is presented. By embedding the ultra-thin silicon layers into a thin flexible polyimide substrate and patterning of silicon into square or hexagonal segmentations, an increased mechanical flexibility and resistance against...
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