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The microstructural evolution and interfacial reactions of the eutectic In-48Sn solder interconnect with Cu and Au/Ni/Cu pads, under current stressing of 0.7×104 A/cm2 at room temperature, have been investigated. The Ni metallization eliminated the current density inside the solder bump region, which is helpful to improve the electromigration reliability. During electromigration, Sn migrated to anode,...
In this study, 0.8 wt% Al2O3 nanoparticles doping Sn3.0Ag0.5Cu (SAC) lead-free solder was prepared through the powder metallurgy route. The microstructures and the electromigration (EM) behavior of the composite solder joints were then studied by an environment scanning electron microscopy (ESEM). After 0.8 wt% Al2O3 nanoparticles addition, finer microstructure with smaller ß-Sn grains was obtained...
The role of under bump metallization becomes more important to control the sharp interfacial reaction. In the study, a Ni-P-WO3 composite layer was developed as a novel UBM for solder interconnection. It's the first time tungsten oxide nanoparticles been used in solder metallization to reinforce the joint. After surface treatment, magnetic stirring and ultrasonically processing, the uniform distribution...
In this study, fullerene nanoparticles (FNSs, a mixture of approximately 80%C60, 20%C70), by varying their weight fractions (0.05, 0.1 and 0.2wt. %) were successfully added into the SAC305 lead free solder to fabricate composite solders through the powder metallurgy processing route. As well as the retained ratios of fullerene reinforcements in the solder joints were firstly tested, the composite...
The physical phenomenon electromigration (EM) and computer simulation methods of EM in microelectronics devices have been reviewed. A multi-physics EM simulation method which can be used to predict voids appearance in conductors has been described and its relevant challenges have been discussed. The optimizing methods for nano-packaging are discussed in this work and shunt structure for solder joint...
Content Addressable Memory (CAM) is a special memory that accomplishes search operation in a single clock cycle but CAM has disadvantages like low bit density and high cost per bit. In this paper, we present an implementation of a 512 x 36 SRAM-based TCAM (SR-TCAM) on a Virtex-5 FPGA, which is the strength of SR-TCAM because currently classical TCAMs cannot be implemented on FPGA. We have used two...
In this study, doped-Sn58Bi solders were prepared by mechanically dispersing Ag nano particles additive in Sn-58Bi solders. The interfacial morphologies of the plain solder and doped Sn-58Bi solders under a direct current (DC) of 2.5 A at 75°C temperature with Cu pads and Au/Ni/Cu on daisy chain type ball grid array (BGA) substrates were characterized. Unlike the plain solder, there is no obvious...
In order to study the effect of nano particles addition to solders on the electro-migration properties, Al doped-Sn58Bi solders were prepared by mechanically dispersing Al particles additive in Sn-58Bi solders. The interfacial morphologies of the plain solder and doped Sn-58Bi solders under a direct current (DC) of 2.5 A at 75°C temperature with Cu pads and Au/Ni/Cu pads on daisy chain type ball grid...
Sn-8Zn-3Bi solder balls with different weight percentages of Sn-Ag-Cu addition were bonded to Au/Ni metallized Cu pads, and the effect of multiple reflow and aging on impact reliability was investigated. In the Sn-Ag-Cu content Sn-Zn-Bi solder joints, the AgZn3 intermetallic compound layer was clearly observed at the interfaces and its thickness increased with an increase the number of reflow cycles...
The effect of nano Ni additions in Sn-9Zn and Sn-8Zn-3Bi solders on their interfacial microstructures and shear strengths with Au/Ni/Cu pad metallization in ball grid array (BGA) applications were investigated. After addition of nano Ni powder in Sn-based lead-free solders, there was no significant changes in the interfacial microstructure. But, in the solder region a very fine Zn phase was observed...
In this study, the microstructural evolution of eutectic SnBi solder in the solid and molten states were clarified using line-type Cu/SnBi/Cu solder joints. When the eutectic SnBi solder was in the solid state during the electromigration (EM) test, a Bi-rich layer formed at the anode side while a Sn-rich band formed at the cathode side, and the intermetallic compound (IMC) at the cathode side was...
The trend towards miniaturization of electronic products leads to the need for very small sized solder joints. Therefore, there is a higher reliability risk that too large a fraction of solder joints will transform into Intermetallic Compounds (IMCs) at the solder interface. In this paper, fracture mechanics study of the IMC layer for SnPb and Pb-free solder joints was carried out using finite element...
A design methodology based on numerical modelling, integrated with optimisation techniques and statistical methods, to aid the process control of micro and nano-electronics based manufacturing processes is presented in this paper. The design methodology is demonstrated for a micro-machining process called Focused Ion Beam (FIB). This process has been modelled to help understand how a pre-defined geometry...
Environmental friendly laws such as Restriction of Hazardous Substance (RoHS) and Waste Electrical and Electronic Equipment (WEEE) have changed the way reverse supply chains operate. The aim of the recyclers is to salvage as much of value from the e-waste, however time delays in inspection and categorizing the product can affect the recovered value. This work studies the effect of time delays on the...
Prognostics and health management enables in-situ assessment of a productpsilas performance degradation and deviation from an expected normal operating condition. A unique hybrid prognostics and health management methodology combining both data-driven and physics-of-failure models is proposed for fault diagnosis and life prediction. The shortcomings of using data-driven and physics-of-failure methodologies...
Ball shear test is the most common test method used to assess the reliability of bond strength for ball grid array (BGA) packages. In this work, a combined experimental and numerical study was carried out to realize of BGA solder interface strength. Solder mask defined bond pads on the BGA substrate were used for BGA ball bonding. Different bond pad metallizations and solder alloys were used. Solid...
Electromigration and thermomigration behaviors of eutectic tin-lead solder joints were studied above 100 degC with the currents ranging from 1.6 A to 2.0 A. The local temperature of the chip was deducted according to temperature coefficient of resistance. Also, this temperature was inspected by a thermal infrared mapping technique. It is suggested that the heat accumulation within first-level solder...
For RoHS compliance, a method coupled inductively coupled plasma-optical emission spectrometry (ICP-OES), gas chromatography-mass spectrometry (GC-MS), and UV-visible spectrophotometry with microwave technology was developed to determine trace Cd, Hg, Pb, Cr6+, PBBs/PBDEs in electronic and electrical products (EEP). Elements were screened by Energy dispersion X-ray fluorescence spectrometry (EDXRF)...
This study employed an electroless Ni-P-carbon nanotubes (Ni-P-CNTs) composite coating as a pad finish for electronic packaging. It aimed at investigating the effect of carbon on the mechanical behavior and microstructure of ball grid array (BGA) solder joints after multiple reflows. Electroless Ni-P and electroless Ni-P-CNTs composite coatings with the same P-content were prepared for comparison...
The e-waste is increasingly flooding Asia, especially China, which could precipitate a growing volume of toxic input to the local environment if not handled properly. This makes the assessment of environmental impact from discarded electronics an essentially important task for end-of-life (EOL) management. Tins paper presents a quantitative investigation of the toxicity of metals in mobile phones...
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