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High-temperature and temperature nonuniformity in high-performance integrated circuits (ICs) can significantly degrade chip performance and reliability. Thus, accurate temperature information is a critical factor in chip design and verification. Conventional volume grid-based techniques, such as finite-difference and finite-element methods (FEMs), are computationally expensive. In an effort to reduce...
High-speed and high-density RDIMMs (Registered Dual Inline Memory Modules) which are employed in server platforms consume significant amount of power, operating at close to 100 °C. Thus it is very important to predict operating temperature of high-power memory modules at the early stage of development procedure to determine which type of cooling solution to employ. In this paper, we propose an approach...
Accurate estimation of temperature profiles from the underlying power dissipation profiles has become an important tool for chip designers and reliability engineers due to increasing power dissipation in ICs and associated thermal effects. IC's surface temperature is conventionally calculated by finite element or finite difference solvers. These methods yield accurate results but the computation time...
Recently VLSI IC design is concerned with the large temperature non-uniformity in high power chips. Thus far, thermal simulations have been limited to steady-state worst case conditions, which have caused the use of conservative margins in thermal designs. Transient temperature characteristics were not simulated in prior art chip-level simulations due to the high computational expense. To drastically...
The reality of high temperature non-uniformity has become a serious concern in the CMOS VLSI industry limiting both the performance and the reliability of packaged chips. Thus the surface temperature profile of VLSI ICs has become critical information in chip design flow. for fast computation of surface temperature profile, power blurring (PB) method has been developed. This method can be applied...
Thermal aware routing and placement algorithms are important in industry. Currently, there are reasonably fast Green's function based algorithms that calculate the temperature distribution in a chip made from a stack of different materials. However, the layers are all assumed to have the same size, thus neglecting the important fact that the thermal mounts which are placed underneath the chip can...
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