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A 3D-IC technology with integrated microchannel cooling is demonstrated in this paper. Fluidic interconnect network fabrication proceeds at the wafer-level, is compatible with CMOS processing and flip-chip assembly and requires four lithography steps. Measurements for single chips prior to 3D stacking reveal that each die in a two chip 3D stack may potentially exhibit a junction-to-ambient thermal...
Gigascale (GSI) chips with high-bandwidth, integrated optoelectronic (OE) components are an emerging technology. This paper identifies the issues related to testing of such chips during high-volume manufacturing. A probe substrate to enable the same is also demonstrated
In this paper, we present the design, fabrication, and demonstration of optical through-wafer interconnects (TWIs). The interconnects were built using standard CMOS and MEMS fabrication processes
An offset-frequency (heterodyne) direction sensitive coherentpulsed Doppler detection method requiring a single digitally synthesized phase-shiftable oscillator and a single mixer is described. Less stringent demands are imposed on hardware in obtaining offset-frequency stability and rejection of internally generated electrical clutter, as compared with the conventional offset method employing two...
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