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Critical applications in areas such as defence, security and space exploration will have design challenges created by factors such as cost, size and tolerance. Scaled technologies will offer a huge potential in these areas, as they are inherently faster, low-power, low-cost and more harsh-environment tolerant. Moving toward nanoscale designs will trigger many design challenges that need to be addressed...
As the chip dimensions increase with chip complexity, interconnects tend to get longer. With the longer on-chip interconnects coupled with a decrease in wire width and wire separation, inductive coupling effects have become non-negligible. Analytical modelling expressions for the estimation of the noise peak voltage of the victim line under worst-case crosstalk noise effect are presented.
With the continued scaling of feature sizes in deep submicron technology, on-chip interconnects have become a dominant factor affecting performance and reliability in high performance integrated circuits (IC). The longer on-chip interconnects coupled with a decrease in wire width and wire separation, inductive effects, and more specifically, mutual inductance coupling between neighbouring wires become...
The increase of clock frequency into the GHz range, coupled with longer length interconnects of small cross-section and low dielectric strength, can result in cross-coupling effects between on-chip interconnects. In this paper, we propose a four-reflection wave propagation based analytical model for estimation of crosstalk. An emphasis was made on the distributed nature of the RLC model used, thus...
The continuous down scaling of feature sizes into deep sub-micrometer dimensions, coupled with the used of high operation frequency in very large scale integration (VLSI) has made the on-chip interconnect the most dominant factor determining the overall circuit signal integrity performance. However, present VLSI interconnects are best modelled as distributed RLC lines. Thus, the generally well-accepted...
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