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A new electromagnetic bandgap structure for power plane noise mitigation in the low frequency range is proposed. It consists of an improved asymmetric square patch with meander lines, optimized inductance and high-K dielectric material for the substrate. An example of PWR/GND plane pairs is analyzed where fundamental stop band is demonstrated over a frequency range of less than 300 MHz to about 1...
This paper investigates the suppression of unwanted noise in high speed power buses by the adoption of photonic crystal power/ground layer (PCPL) structure. The performance of PCPL with different densities of high dielectric rods is analyzed in terms of S-parameters and electric field distribution. An attempt is made in order to relate geometrical properties (like rods' density and filling ratio)...
A high-performance substrate integrated waveguide (SIW) filter formed by top and bottom metal layers which embed a dielectric slab and two sidewalls of metallic vias is presented. Two different configurations (named as in-line and off-line) are proposed and two different design techniques are discussed: direct method and indirect method. In both cases modeled/simulated results are validated by means...
In this paper a two dimensional (2D) electromagnetic Bandgap (EBG) structure is proposed for multi band noise mitigation in PWR/GND plane pairs. Excellent noise suppression (-60 dB) is achieved in multiple bands within the range 0-8 GHz with a low start frequency. Because of the 2D EBG, no additional metal layer is required. Signal Integrity analysis is also studied by modelling a microstrip to stripline...
In this paper a two dimensional (2D) electromagnetic bandgap (EBG) structure is proposed for SSN mitigation in PWR/GND plane pairs. Excellent noise suppression (-60 dB) is achieved in multiple bands within the range 0-8 GHz with a low start frequency. Because of the 2D EBG, no additional metal layer is required. Signal integrity analysis is also studied by modelling a microstrip to stripline transition...
The present paper investigates the sensitivity of the transmission properties of a simple stripline model to the copper surface roughness. Different profiles are modeled and analyzed by means of three dimensional full wave numerical simulations. Hammerstad and Jensen analytical formulation is demonstrated to be valid only for a specific profile of surface roughness. A visual basic macro is implemented...
Aim of this paper is the signal integrity analysis of multilayer boards with emphasis on the effect of non-functional pads. In particular it is demonstrated how removing the nonfunctional pads to reduce the coupling mechanisms of the pads with the planes above and/or below can not be considered a general rule of thumb due to possible larger impedance variation (TDR). Accurate and reliable numerical...
Object of this paper is the analysis of a conformal wire antenna used for the detection of stolen cars. The antenna operates in the low frequency range 0-300 MHz and it is located on the top part of the metallic chassis, over the back tire. Details on the simulation model are provided and results are validated by comparing different numerical methods: time domain (Finite Integration Technique and...
In this work the analysis of the signal and the power integrity performances of two different types of EBG structures in presence of single ended and differential striplines is proposed. The two EBG patterns have square patches and double L or meandered branches. The signal quality is measured in terms of the transmission parameter S21 and the eye pattern at the terminations; the power integrity is...
The present paper investigates the sensitivity of on wafer interconnect to the Si CMOS process parameters. In particular the tapered (trapezoid) etching and the conductor surface profile (Rrms) of copper foils are numerically analyzed in order to quantify their effect on the electrical performance of a stripline structure. Line impedance, insertion loss and time signal attenuation are evaluated by...
This paper describes the parallel-plate waveguide (PPW) noise mitigation by means of shorting vias and/or Virtual Island. The proposed method is already know in literature, nevertheless important considerations are here addressed: 1) the same noise mitigation level proposed in [S. Nam et. al., IEEE Trans. on Microwave Theory and Technique (2005)] can be achieved by using only shorting vias, 2) the...
The high speed digital processing in modern electronic products has made more difficult the achievement of conformity about limits emissions. To verify the requirements of standards on these emissions the use of a metallic enclosure is often necessary: in this way the power radiated by the system is reduced. In this paper the radiated emissions and the shielding performance of a metallic rack with...
Aim of this paper is to describe the simultaneous switching noise (SSN) mitigation by means of a novel electromagnetic band gap (EBG) structure with triangle patches and hexagonal array. The proposed EBG structure allows achieving -40 dB stop band within the frequency range 6.5-9 GHz. Parametric analysis including the radius effect of the metal plated vias, the via length and the distance between...
The present paper investigates the power supply noise in multilayered IC packages and analyzes the effect of shorting vias. A full wave code, based on the Finite Integration Technique (FIT), is used for the numerical simulations and it is validated by means of measurements. Furthermore two different solvers are employed to verify the accuracy of the proposed model: time domain and frequency domain...
The ever growing increase in speed of digital signals has made more difficult the achievement of conformity about limits emissions. It often happens that to verify the requirements of standards on these emissions the use of a metallic enclosure is necessary: in this way the power radiated by the system is reduced. The effect on radiated emission due to the presence of a slot on the frontal part of...
Aim of this paper is the validation in both frequency and time domain of the procedure to extract fully H-Spice compatible equivalent circuits of structures on printed circuit boards. The procedure is initiated by standard measurement of scattering parameters between 40 MHz to 20 GH. After the extraction of the equivalent circuit, the computed scattering parameters are compared with those measured...
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