The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The integration of Through-Silicon Vias (TSVs) in CMOS wafers has the potential to cause performance shifts of devices in close proximity due to mobility change caused by mechanical stress. To ensure successful integration of TSV into a baseline technology, these shifts must be negligible to allow seamless integration of TSVs into circuit designs. As the first publication of its kind by an advanced...
This paper describes the process development of TSV integration with 20nm CMOS technology and device performance characterization for 3D integrated circuit (3DIC) enablement. 6×55um Through-silicon-via (TSV) on 20nm CMOS technology has been developed and demonstrated. Key module process issues, such as V0 high resistance, M1 high leakage and Cu pumping which prevent TSV to be integrated with BEOL...
This paper presents the impact of wafer thinning process on GLOBALFOUNDRIES high-k metal gate CMOS wafers with TSV. The initial study of wafer backside surface finish and thickness was performed on non-TSV wafers, and the impact on active devices such as: MOS (metal-oxide semiconductor) capacitors, ring oscillators, analog circuit performance and front end of line (FEOL) reliability macros was characterized...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.