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3D LSI chip stacking technology have been developed using cone shape Au micro bumps fabricated by nanoparticle deposition method. The cone shape bumps with less than 10 um diameter are suitable for a thermocompression bump joint process with low temperature and low load force. High yield micro bump joints can be obtained. In this study, the property evaluation of the cone shape bumps, and the cone...
A high temperature resistant joint technology for bonding SiC power devices is developed using a transient liquid phase sintering (TLPS) process with a paste containing Cu and Sn powders with the size less than 15µm. The SiC devices are bonded to the Si3N4/Cu/Ni(P) substrate with the TLPS process at 260°C in a N2 atmosphere for 20 minutes. The microstructure of the bond is mainly composed of Cu6Sn...
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