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In this work, the 14 nm CPI (Chip and Package Interaction) challenges, development and qualification were investigated by using 80 um pitch Cu pillar BOL (Bump on Lead) technology in flip chip CSP package. We evaluated 14 nm BEOL (Backend of Line) film strength and adhesion in the torture tests as an early assessment. After passing the torture tests, the package is evaluated in the CPI reliability...
Transparent conductive electrodes (TCE) possessing a combination of high optical transmission and good electrical conductivity find applications in numerous optoelectronic devices. In this study, we propose the low cost fabrication of a fine metal mesh structure on rigid (glass) and flexible (PET) substrates as a promising and feasible approach for fulfilling large size TCE requirements. We have utilized...
Front-side metallization techniques for nonconductive substrates receives numerous attention due to their practical application importance in the microelectronic and solar cell industries. Electroless deposition of Ni(P) with the help of catalyst such as Sn/Pd colloids is a common method to deposit a metallic film on non-conductive substrates. However, weak physical adsorption of the Sn/Pd colloids...
This paper focuses on the performance of IPM (Intelligent Power Module) under power cycling test which is simulated by a FEA (Finite Element Analysis) method. Through the method of control variables some key parameters about the module's thermal and structure properties can be obtained. The key parameters in the calculation include power dissipation of silicon chip, cycle period, different materials...
This paper focuses on the performance of IPM (Intelligent Power Module) under power cycling test which is simulated by a FEA (Finite Element Analysis) method. Through the method of control variables some key parameters about the module's thermal and structure properties can be obtained. The key parameters in the calculation include power dissipation of silicon chip, cycle period, different materials...
In current chip and package designs, it is a bottleneck to simultaneously optimize both pin assignment and pin routing for different design domains (chip, package, and board). Usually the whole process costs a huge manual effort and multiple iterations thus reducing profit margin. Therefore, we propose a fast heuristic chip-package co-design algorithm in order to automatically obtain a bump assignment...
This work demonstrates the high-temperature and high speed operation of solar-blind deep ultraviolet (DUV) metal-semiconductor-metal (MSM) Schottky photodectors (PDs) up to 300 °C using AlN thin films on Si(100) substrates. For 2-MeV proton irradiation, the photocurrent-to-dark-current ratio (PDCR) value of AlN MSM PDs is 0.7 under a 5 V bias at proton fluences up to 1013 cm−2, enabling highly specific...
This paper demonstrates that the quantum-confined stark effect of InGaN-based light-emitting diodes can be enhanced by the means of using the hexagonal nano-post patterned sapphire substrates based on the increase of the post-duty cycle.
The thermal stress and mechanical induced reliability issues of the Mo layer deposited on polyimide (PI) flexible substrate are studied. We found that the CIGS film cracks after one-hour 400°C selenization process. And the CIGS crack was initiated from the cracking of the Mo film and it can be improved by a Mo annealing process before the precursor deposition. Lower the ramping rate of the selenization...
Due to the advantage of flip-chip design in power distribution but controversial peripheral IO placement in lower design cost, redistribution layer (RDL) is usually used for such interconnection. Sometimes RDL is so congested that the capacity for routing is insufficient. Routing therefore cannot be completed within a single layer even for manual routing. Although [2] proposed a routing algorithm...
Deep submicron technology devices with different width/length were exposed by gamma ray irradiation. Different total ionizing dose (TID) effects were observed for the wide and narrow channel device. Large increase of off-state leakage was observed for the wide channel device under radiation. However, insignificantly increase of off-state leakage was observed for the narrow channel one. The simulation...
To improve the quality of deposited amorphous germanium (a-Ge) on the Si substrate, a re-crystallization method of a-Ge by laser annealing is demonstrated. Laser annealing has two important advantages: high energy density E (700, mJ/cm2) is melting the a-Ge and a lot of laser spot quantity (20 spots) is alteration the a-Ge quality. These two factors were carefully designed to fabricate the high quality...
We report on an approach for fabricating transparent electrodes on a plastic substrate by annealing AZO nanoparticles using a pulsed UV laser. For the resulting AZO film, the resistivity is 7.6×10−2 Ω-cm and the transmittance is over 80% within the wavelength from 400 to 800 nm. This method is straightforward and executable in the ambient environment and at room temperature.
This paper presents the modeling and control of a Flexure-Based Electromagnetic Linear Actuator (FELA) that is employed as a high-precision imprinting actuator of a desktop hot-embossing imprinter. In this work, a systematic approach of obtaining the unknown physical parameters of FELA is presented. Subsequently, these parameters are used to design two model-based PID controllers that allow the FELA...
In recent years, in order to handle various sources of noise (including substrate and power supply noises) and process variation in high-end mixed-signal circuit design, analog circuits are often required to be placed symmetrically to the common axis, and high noise digital circuits need to be placed far away from noise interference to the analog blocks. In this paper, we obtain the mixed-signal SoC...
Due to increasing complexity of design interactions between the chip, package and PCB, it is essential to consider them at the same time. Specifically the finger/pad locations affect the performance of the chip and the package significantly. In this paper, we have developed techniques in chip-package codesign to decide the locations of fingers/pads for package routability and signal integrity concerns...
A dual-mode bandpass filter using the degenerate modes of a meander square ring structure printed on the high-permittivity substrate is proposed. The dual-mode resonator is based on a square ring loaded with two meander strips at the coupling sides. The filter is printed on the A1203 substrate with a permittivity of 9.8 and could be easily integrated with RF circuits. Besides its simple structure,...
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