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Drop ball reliability for Ball Grid Array (BGA) package on lead-free product is a major reliability concern. Integrating a polymer core in the solder ball could be a good strategy to dissipate stress better compared to the purely metallic solder ball. However, the diffusion rate of the copper is much faster than the diffusion rate of the solder. Hence, Kirkendall voids starts forming and causing crack...
Restriction of Hazardous Substance (RoHS) Regulation came into effect in 2006 due to the hazardous effects of lead to human's health and toxicity for environment. As such, the leaded solder ball was replaced by lead-free solder ball which is now widely used in semiconductor industries. However, there was a concern on the robustness of lead-free solder ball especially on drop ball issues when compared...
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