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In this paper, we present recent results on mechanical strength and reliability of Cu/Sn bond frames with reduced foot-print, for wafer-level packaging of Micro and Nano-devices. The structures of the test vehicle and intermediate multi-layer of bond frames were designed and fabricated on cap and substrate wafers. Electroplated Cu/Sn frames were bonded at temperature 270 °C in an EVG501 wafer bonder...
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