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The 3D-DRAM stacked over the processor is a vibrant technique in order to overcome the memory wall as well as the bandwidth wall problems. We considered a system with two DRAM dies over a single processor die. We assumed the decoupling capacitors to be placed on each DRAM die and connected to the power distribution TSV pairs, where the TSVs pass through the DRAM stack. In this paper we proposed a...
This paper proposes a novel technology to fabricate 3D curved structures on SU-8 resist by a photo-acid-diffusion process. This technology deliberately modifies the standard SU-8 photolithography procedure and allows the diffusion of photo-acid released from UV-exposed regions into the adjacent unexposed resist regions, which would result in forming smooth 3D curved structures after cross-linking...
Size of on-chip interconnects as well as the supply voltage is reducing with each technology node whereas the operating speed is increasing in modern VLSI design. Today, the package inductance and resistance has been reduced to such an extent that core switching noise caused by on-chip inductance and on-chip resistance is gaining importance as compared to I/O drivers switching noise. Both on-chip...
On-chip power supply noise has become a bottleneck in 3D ICs as scaling of the supply network impedance has not been kept up with increasing device densities and operating currents with each technology node due to limited wire resources. In this paper we proposed an efficient and accurate model to estimate peak-to-peak switching noise, caused by simultaneous switching of logic loads along a vertical...
How peak-to-peak switching noise as well as the LC resonance term varies by varying different circuit parameters of a power distribution TSV pair (having decoupling capacitance and logic load), within a 3D stack of ICs interconnected through TSVs.
Extensive transient simulations for on-chip power delivery networks are required to analyze power delivery fluctuations caused by dynamic IR and Ldi/dt drops. Speed and memory has become a bottleneck for simulation of power distribution networks in modern VLSI design where clock frequency is of the order of GHz. The traditional SPICE based tools are very slow and consume a lot of memory during simulation...
On-chip power distribution network model for simultaneous switching of 3D ICs stacked through TSVs to choose TSV pattern, maximum number of chips in a stack and location of the decoupling capacitor for early design trade-offs.
According to the requirement of characteristics of large-scale 3D coordinates on-line measurement system, a method of mobile 3D coordinates measurement camera internal parameters self-calibration was presented in this paper. Through measurements of multiple stations, sufficient pictures of coded targets and un-coded ones were obtained. And a bundle adjustment calibration method based on collinear...
With the evolution of mobile communication networks, three-dimensional graphics applications and services are fast developing fields in mobile graphics and wireless networks. While the data size of 3D meshes is increasing, the available bandwidth of wireless networks and the weak resources of mobile devices have become relatively limited. The transmission of graphics multimedia over wireless networks...
We consider the problem of 3D modeling under the environments where colors of the foreground objects are similar to the background, which poses a difficult problem of foreground and background classification. A purely image-based algorithm is adopted in this paper, with no prior information about the foreground objects. We classify foreground and background by fusing the information at the pixel and...
Three-dimension (3D) modeling and visualization of stratum plays important role in seismic active fault detection, of course in geoinformation science. Well-logging data of strata is taken as time series. Similarity measure of subsequence search is proposed based on dynamic time warping (DTW). Realizing time series match in different length of time series. The frequent pattern mining experiment is...
In this paper, the mixed modeling method combining surface modeling and volume modeling is used to construct urban subsurface geological structure firstly using existing technique of 3D modeling and visualization for reference, which considers effectively the layer and block structure characteristic inside urban subsurface geological body. Then, volume visualization scheme is designed and 3D volume...
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