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The Zn-Al solder alloy is a promising candidate to replace the conventional high lead solders (Pb-5Sn, Pb-10Sn) in automotive applications, which work in a harsh environment combined with thermal and mechanical loads. In this work, the effects of concurrent vibration and elevated temperature on the Zn-Al solder interconnection on Cu or Ni-P plated Cu substrates were studied. The test samples by forming...
Thin-walled parts are easy to deform during the machining process. The machining conditions of such parts are difficult to monitor since both tool wear and work-piece deformation need to be carefully monitored. Usually, the characteristic vector constructed based on monitoring signals can be deemed as the basis to recognize different machining conditions. In order to construct the characteristic vector,...
The aim of this work is to consider the issues and challenges in designing and setting up a suitable testing regime which can be utilized for the electronics under the combination of harsh conditions. The ultimate objective is to evaluate the reliability and service life of electronic components that are subject to a combination of multiple loadings which can take the forms of mechanical, thermal,...
In this study, the nano-scale interfacial details of ultrasonic copper ball bonding to an aluminum metallization in the as-bonded states were investigated using high resolution scanning/transmission electron microscopy with energy dispersive spectroscopy. Our results showed that ultrasonic vibration swept aluminum oxide and copper oxide in some regions of contacting surface, where an approximate 20...
Indium bump bonding has been employed to realize very high density interconnection used for hybrid pixel detector systems. The connection pitch sizes to achieve this may be below 50 mum for these assembly applications, such that the packaging density, i.e. I/Os, may exceed 40,000/cm2. Electrodeposition is a promising approach to enable a low- cost and high yield bump bonding process, compared with...
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