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Sn-Ag-Cu (SAC) solders are susceptible to appreciable microstructural coarsening due to the combined effect of thermal and mechanical stimuli during service and storage. This results in evolution of joint properties over time, and thereby influences the long-term reliability of microelectronic packages. Accurate prediction of this aging behavior is therefore critical for joint reliability predictions...
Predicting reliability of solder joints requires a thorough understanding of solder constitutive behavior. Recent studies on SnAgCu solder alloys have reported that pre-test conditions of aging-time and aging-temperatures can be factors that significantly affect solder constitutive behavior. The results presented here are a part of ongoing efforts to construct constitutive models that can predict...
Constitutive models for SnAgCu solder alloys are of great interest at the present. Commonly, constitutive models that have been successfully used in the past for Sn-Pb solders are used to describe the behavior of SnAgCu solder alloys. Two issues in the modeling of lead-free solders demand careful attention: 1) Lead-free solders show significantly different creep strain evolution with time, stress...
The need for predicting fatigue life in solder joints is well appreciated at the present time. Currently, however, there are very few experimentally validated material parameters for popular SnAgCu alloys. Furthermore, the validity of Coffin-Manson life models, being empirical, also needs to be explored for these alloys which creep in a manner significantly different from SnPb solder alloys. In this...
Predicting the fatigue life of solder interconnections is a challenge due to the complex nonlinear behavior of solder alloys and the load history. Long experience with Sn-Pb solder alloys together with empirical fatigue life models such as the Coffin-Manson rule have helped us identify reliable choices among package design alternatives. However, for the currently popular Pb-free choice of SnAgCu solder...
Commonly, constitutive models of solder alloys are derived from mechanical tests performed on either bulk solder specimens or on specially assembled BGA test coupons where the stresses are borne by solder ball interconnects. It has been widely recognized that models derived from bulk sample test data may not be reliable when predicting deformation behavior at the solder interconnect level due to the...
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